The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Apr. 07, 2016
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Karl Weidner, Munich, DE;

Kai Kriegel, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/373 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 23/482 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/34 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/4012 (2013.01); H01L 23/482 (2013.01); H01L 23/49811 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/72 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 25/162 (2013.01); H01L 25/165 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 24/29 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/73251 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/146 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/14252 (2013.01);
Abstract

The present disclosure relates to power modules. The teachings thereof may be embodied in a power unit and/or a drive unit for driving the power unit, along with methods for producing a power module. For example, a power module may include: a power unit including a heat sink; a power device disposed on the heat sink; an insulating layer covering the heat sink and the power device; and a drive unit for driving the power unit, the drive unit comprising a contact element corresponding to the contact area of the power unit. An underside of the power unit is defined by an underside of the heat sink. A top side of the power unit is defined by a contact area thermally and/or electrically coupled to the power device and a surface of the insulating layer surrounding the contact area. The contact element may be disposed abutting the contact area of the power unit for making electrical and/or thermal contact with the power device.


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