The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Jan. 09, 2019
Applicant:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Inventors:
Peter J. Klaerner, Corona, CA (US);
Jason Fu, Long Beach, CA (US);
Christoph Benno Luechinger, Irvine, CA (US);
Assignee:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); H01L 23/00 (2006.01); B23K 20/10 (2006.01); B23K 20/26 (2006.01); B23K 101/40 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); B23K 20/004 (2013.01); B23K 20/10 (2013.01); B23K 20/26 (2013.01); H01L 24/85 (2013.01); B23K 2101/40 (2018.08); H01L 23/367 (2013.01); H01L 2224/78313 (2013.01); H01L 2224/78704 (2013.01); H01L 2224/78753 (2013.01); H01L 2224/78901 (2013.01); H01L 2224/85123 (2013.01); H01L 2224/85129 (2013.01); H01L 2224/85205 (2013.01);
Abstract
A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).