The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Dec. 06, 2018
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventor:
Dario Vitello, Calolziocorte, IT;
Assignee:
STMICROELECTRONICS S.r.l., Agrate Brianza, IL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 21/4821 (2013.01); H01L 23/49541 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/45 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83194 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83205 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A method of attaching a semiconductor die or chip onto a support member such as a leadframe comprises: applying onto the support member at least one stretch of ribbon electrical bonding material and coupling the ribbon material to the support member, arranging at least one semiconductor die onto the ribbon material with the ribbon material between the support member and the semiconductor die, coupling the semiconductor die to the ribbon material.