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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10763190 B1

PDFFull Text
Expired
Date of Patent:
Sep. 01, 2020

Filed:

May. 11, 2016

Power semiconductor module, power conversion device using same, and method for manufacturing power conversion device

Applicant:

Hitachi Automotive Systems, Ltd., Ibaraki, JP;

Inventors:

Nobutake Tsuyuno, Tokyo, JP;

Morio Kuwano, Hitachinaka, JP;

Takeshi Tokuyama, Tokyo, JP;

Assignee:

HITACHI AUTOMOTIVE SYSTEMS, LTD., Hitachinaka-Shi, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/34 (2006.01); H01L 23/06 (2006.01); H01L 21/00 (2006.01); H01L 23/473 (2006.01); H01L 25/18 (2006.01); H01L 25/07 (2006.01); H05K 7/20 (2006.01); H01L 21/52 (2006.01); H01L 23/00 (2006.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/52 (2013.01); H01L 24/29 (2013.01); H01L 24/33 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H05K 7/20 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/33 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract

Provided is a compact power conversion device which is excellent in liquid tightness and has high reliability of a terminal connection portion. A power conversion device according to the present invention includes: a case that houses a power semiconductor; a flow path forming body that forms a flow path with an outer surface of the case; a first fixing material in contact with a refrigerant flowing in the flow path; and a second fixing material that is in contact with the first fixing material and the flow path forming body and covers a direction of displacement of the case of the first fixing material caused by water pressure.

Find Patent Forward Citations

Tsuyuno, Nobutake. (2020). Power semiconductor module, power conversion device using same, and method for manufacturing power conversion device (U.S. Patent No. 10763190). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10763190

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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