The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Apr. 25, 2017
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventors:
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 23/373 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/147 (2013.01); H01L 23/142 (2013.01); H01L 23/3142 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/3735 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01);
Abstract
A power module substrate or the like including an insulating substrate with an upper surface and a lower surface, a metal plate with an upper surface and a lower surface, the lower surface facing and being bonded to the upper surface of the insulating substrate, and a first electroplating layer that partly covers the central portion of the upper surface of the metal plate. The first electroplating layer includes at least a silver layer, and the grain size of silver in the silver layer is more than or equal to the grain size of a metal in an upper surface portion of the metal plate.