The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Nov. 25, 2016
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Naohiro Ogushi, Tokyo, JP;

Koichi Taguchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/055 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/055 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48155 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A case () surrounds a semiconductor chip (). A case electrode () is attached to an upper face of the case (). A wire () is connected to the semiconductor chip () and the case electrode (). A first holding portion () presses down the case electrode () on the upper face of the case () outside a joint portion where the wire () is bonded to the case electrode (). A second holding portion () presses down the case electrode () on the upper face of the case () inside the joint portion. A recess () is formed on the upper face of the case (). The case electrode () is bent such as to fit into the recess (). The second holding portion () is disposed inside the recess ().


Find Patent Forward Citations

Ogushi, Naohiro. (2020). Semiconductor device (U.S. Patent No. 10763183). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10763183

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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