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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10763135 B1

PDFFull Text
Date of Patent:
Sep. 01, 2020

Filed:

Jan. 30, 2018

Integrated elastomeric interface layer formation and singulation for light emitting diodes

Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Pooya Saketi, Cork, IE;

Karsten Moh, Saarbrucken, DE;

Tilman Zehender, Cork, IE;

Assignee:

Facebook Technologies, LLC, Menlo Park, CA (US);

Attorney:

Fenwick & West LLP

Primary Examiner:

Stephen W Smoot

Int. Cl.
CPC ...
H01L 33/44 (2010.01); H01L 21/67 (2006.01); H01L 33/06 (2010.01); H01L 33/24 (2010.01); H01L 33/40 (2010.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01J 37/32 (2006.01); H01L 33/10 (2010.01); H01L 21/784 (2006.01); H01L 27/15 (2006.01); H01L 21/683 (2006.01); B65G 47/90 (2006.01); H01S 5/183 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01); H01J 37/321 (2013.01); H01L 21/6836 (2013.01); H01L 21/784 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/0095 (2013.01); H01L 33/06 (2013.01); H01L 33/10 (2013.01); H01L 33/24 (2013.01); H01L 33/405 (2013.01); H01L 33/44 (2013.01); B65G 47/90 (2013.01); H01J 2237/334 (2013.01); H01L 2933/0025 (2013.01); H01S 5/183 (2013.01);
Abstract

Embodiments relate to an integrated process for forming an elastomeric layer over an epitaxial structure of multiple light emitting diode (LED) dies, and then etching the elastomeric layer into individual elastomeric interface layers (elayers) on each of the LED dies and etching the epitaxial structure to singulate the LED dies. The elayer allows each LED die to be picked up by a pick-up head (or pick and place head (PPH)), and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (uLED) dies.

Find Patent Forward Citations

Saketi, Pooya. (2020). Integrated elastomeric interface layer formation and singulation for light emitting diodes (U.S. Patent No. 10763135). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10763135

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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