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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10763112 B1

PDFFull Text
Date of Patent:
Sep. 01, 2020

Filed:

Dec. 28, 2018

Method for manufacturing device

Applicants:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Toshiba Electronic Devices & Storage Corporation, Minato-ku, JP;

Inventor:

Etsuo Hamada, Himeji, JP;

Assignees:

KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;

TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Minato-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Caleen O Sullivan

Int. Cl.
CPC ...
H01L 21/027 (2006.01); H01L 21/78 (2006.01); H01L 21/28 (2006.01); H01L 21/306 (2006.01); H01L 29/40 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); G03F 7/038 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); H01L 21/04 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0274 (2013.01); G03F 7/038 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/2024 (2013.01); G03F 7/26 (2013.01); H01L 21/0272 (2013.01); H01L 21/0475 (2013.01); H01L 21/0485 (2013.01); H01L 21/28 (2013.01); H01L 21/30625 (2013.01); H01L 21/78 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/401 (2013.01); H01L 29/6606 (2013.01); H01L 29/66068 (2013.01); H01L 29/66212 (2013.01); H01L 29/66333 (2013.01); H01L 29/66522 (2013.01); H01L 21/02057 (2013.01);
Abstract

According to one embodiment, a method for manufacturing a device includes a first process, a second process, a third process, and a fourth process. The first process includes providing a structure body at a first surface of a substrate. The substrate is light-transmissive and has a second surface. A light transmissivity of the structure body is lower than a light transmissivity of the substrate. The second process includes providing a negative-type photoresist at the second surface. The third process includes irradiating the substrate with light to expose a portion of the photoresist. The light is irradiated in a first direction from the first surface toward the second surface. The light passes through the substrate. The fourth process includes developing the photoresist to remain the portion of the photoresist in a state of being adhered to the second surface and to remove other portion of the photoresist.

Find Patent Forward Citations

Hamada, Etsuo. (2020). Method for manufacturing device (U.S. Patent No. 10763112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10763112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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