The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Aug. 15, 2017
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jong Yoon Jang, Suwon-si, KR;

Seok Hwan Ahn, Suwon-si, KR;

Jeong Min Cho, Suwon-si, KR;

Tae Hoon Kim, Suwon-si, KR;

Jin Gul Hyun, Suwon-si, KR;

Se Woong Paeng, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/06 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 27/29 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01F 41/041 (2013.01); H01F 41/042 (2013.01); H01F 41/122 (2013.01); H01F 2027/2809 (2013.01);
Abstract

There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.


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