The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Dec. 24, 2018
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Hiroshi Tamagawa, Kyoto, JP;
Hiroki Yamamoto, Kyoto, JP;
Katsuya Matsuura, Kyoto, JP;
Yasuhiro Kondo, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/14 (2006.01); H01G 5/38 (2006.01); H01G 2/16 (2006.01); H01F 27/40 (2006.01); H01F 27/28 (2006.01); H01C 10/50 (2006.01); H01C 10/16 (2006.01); H01G 5/011 (2006.01); H01L 27/08 (2006.01); H01C 17/00 (2006.01); H01C 17/23 (2006.01); H05K 3/34 (2006.01); H01L 33/62 (2010.01); H01G 4/38 (2006.01); H01G 4/40 (2006.01); H01L 25/10 (2006.01); H01L 25/13 (2006.01); H01L 27/15 (2006.01); H01G 4/33 (2006.01); H01G 5/40 (2006.01); H05K 1/18 (2006.01); H01F 29/08 (2006.01); H01F 41/04 (2006.01); H01L 23/00 (2006.01); H01F 29/00 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01C 1/14 (2013.01); H01C 10/16 (2013.01); H01C 10/50 (2013.01); H01C 17/006 (2013.01); H01C 17/23 (2013.01); H01F 27/2804 (2013.01); H01F 27/40 (2013.01); H01F 29/00 (2013.01); H01F 29/08 (2013.01); H01F 41/041 (2013.01); H01G 2/16 (2013.01); H01G 4/33 (2013.01); H01G 4/38 (2013.01); H01G 4/40 (2013.01); H01G 5/011 (2013.01); H01G 5/38 (2013.01); H01G 5/40 (2013.01); H01L 24/32 (2013.01); H01L 25/105 (2013.01); H01L 25/13 (2013.01); H01L 27/0802 (2013.01); H01L 27/15 (2013.01); H01L 33/62 (2013.01); H05K 1/181 (2013.01); H05K 3/3442 (2013.01); H05K 3/3478 (2013.01); H01F 17/0006 (2013.01); H01L 2221/68304 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01); H01L 2933/0066 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10212 (2013.01); H05K 2203/0415 (2013.01); Y02P 70/613 (2015.11);
Abstract
A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.