The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

May. 06, 2019
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Christopher Celebrese, Niskayuna, NY (US);

Lili Zhang, Niskayuna, NY (US);

Wei Zhang, Niskayuna, NY (US);

Anil Duggal, Niskayuna, NY (US);

Weijun Yin, Niskayuna, NY (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 3/04 (2006.01); B32B 19/04 (2006.01); H01B 13/06 (2006.01); H01B 3/30 (2006.01); H01B 13/08 (2006.01);
U.S. Cl.
CPC ...
H01B 3/04 (2013.01); B32B 19/048 (2013.01); H01B 3/30 (2013.01); H01B 13/06 (2013.01); B32B 2315/10 (2013.01); B32B 2367/00 (2013.01); H01B 13/08 (2013.01);
Abstract

An insulative assembly includes an insulative mica-based carrier film and first and second resistive grading layers joined to opposite sides of the mica-based carrier film. The first resistive material layer is configured to engage one or more conductors and insulate the one or more conductors from at least one other conductor. A method for creating an insulative assembly for one or more conductors includes obtaining an insulative mica-based carrier film, depositing a first resistive grading layer on a first side of the mica-based carrier film, and depositing a second resistive grading layer on an opposite, second first side of the mica-based carrier film.


Find Patent Forward Citations

Loading…