The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Aug. 12, 2019
Applicant:

Magnecomp Corporation, Murrieta, CA (US);

Inventors:

Peter Hahn, Bangkok, TH;

Kuen Chee Ee, Chino, CA (US);

Long Zhang, Murrieta, CA (US);

Assignee:

Magnecomp Corporation, Murrieta, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/00 (2006.01); H01L 41/00 (2013.01); B32B 38/00 (2006.01); B32B 37/00 (2006.01); G11B 21/00 (2006.01); G11B 5/48 (2006.01); H01L 41/297 (2013.01); H01L 41/33 (2013.01); G11B 5/56 (2006.01); B32B 38/18 (2006.01); B32B 37/12 (2006.01); G11B 21/10 (2006.01); G11B 5/55 (2006.01); B32B 37/04 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
G11B 5/483 (2015.09); G11B 5/4853 (2013.01); G11B 5/4873 (2013.01); H01L 41/297 (2013.01); H01L 41/33 (2013.01); B29C 2793/0027 (2013.01); B29C 2793/0036 (2013.01); B32B 37/04 (2013.01); B32B 37/1207 (2013.01); B32B 37/1292 (2013.01); B32B 38/0036 (2013.01); B32B 38/10 (2013.01); B32B 38/185 (2013.01); B32B 2038/0076 (2013.01); G11B 5/48 (2013.01); G11B 5/4806 (2013.01); G11B 5/4846 (2013.01); G11B 5/5552 (2013.01); G11B 5/56 (2013.01); G11B 21/10 (2013.01); G11B 21/106 (2013.01); Y10T 156/10 (2015.01); Y10T 156/1052 (2015.01);
Abstract

A method of assembly a dual stage actuated suspension includes either applying an adhesive to a microactuator motor and then B-staging the adhesive, or applying an adhesive that has already been B-staged such as in film adhesive form to the microactuator then assembling the microactuator into a suspension and then finishing the adhesive cure. The adhesive can be applied to bulk piezoelectric material, with the adhesive being B-staged either before or after it is applied to the bulk piezoelectric material, and the piezoelectric material then singulated into a number of individual piezoelectric microactuators. The method allows greater control over how much adhesive is used, and greater control over spread of that adhesive and control over potential contamination, than traditional liquid epoxy dispense methods.


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