The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Aug. 01, 2018
Applicant:

Taiwan Biophotonic Corporation, Zhubei, Hsinchu, TW;

Inventors:

Chang-Sheng Chu, Hsinchu, TW;

Yu-Tang Li, Hsinchu, TW;

Yeh-Wen Lee, Hsinchu, TW;

Chih-Hsun Fan, Hsinchu, TW;

Lung-Pin Chung, Hsinchu, TW;

Jyh-Chern Chen, Hsinchu, TW;

Shuang-Chao Chung, Hsinchu, TW;

Assignee:

Taiwan Biophotonic Corporation, Hsinchu, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); G01J 1/04 (2006.01); A61B 5/1455 (2006.01); A61B 5/00 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/173 (2006.01); H01L 25/16 (2006.01); G01J 1/02 (2006.01); G01J 3/36 (2006.01); G01J 1/44 (2006.01); H04B 10/071 (2013.01); G01J 1/42 (2006.01); G01J 1/08 (2006.01); H01L 31/12 (2006.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
G01J 1/0459 (2013.01); A61B 5/14552 (2013.01); A61B 5/681 (2013.01); G01J 1/0209 (2013.01); G01J 1/029 (2013.01); G01J 1/0214 (2013.01); G01J 1/0271 (2013.01); G01J 1/0407 (2013.01); G01J 1/0411 (2013.01); G01J 1/0437 (2013.01); G01J 1/0488 (2013.01); G01J 1/08 (2013.01); G01J 1/4228 (2013.01); G01J 1/44 (2013.01); G01J 3/36 (2013.01); H01L 25/167 (2013.01); H01L 31/0203 (2013.01); H01L 31/0232 (2013.01); H01L 31/02325 (2013.01); H01L 31/02327 (2013.01); H01L 31/125 (2013.01); H01L 31/173 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H04B 10/071 (2013.01); A61B 2560/0443 (2013.01); A61B 2562/0233 (2013.01); A61B 2562/164 (2013.01); A61B 2562/227 (2013.01);
Abstract

A dual sensor module includes a substrate, a light source, a first encapsulant, a second encapsulant, a photodetector, and an electrode. The light source is disposed on the substrate. The first encapsulant is formed over the light source. The photodetector is disposed on the substrate. The second encapsulant is formed over the photodetector. The electrode is electrically connected to the substrate and is entirely located between the light source and the photodetector. A dual sensing accessory and a dual sensing device having the dual sensor module for detecting optical and electrical properties are also provided.


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