The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Oct. 01, 2018
Honeywell International Inc., Morris Plains, NJ (US);
Stephane Ferrasse, Spokane, WA (US);
Frank C. Alford, Spokane Valley, WA (US);
Susan D. Strothers, Mead, WA (US);
Ira G. Nolander, Spokane, WA (US);
Michael R. Pinter, Spokane, WA (US);
Patrick Underwood, Spokane, WA (US);
Honeywell International Inc., Morris Plains, NJ (US);
Abstract
A method of forming a high strength copper alloy. The method comprises heating a copper material including from about 2 wt. % to about 20 wt. % manganese by weight of the copper material to a temperature above 400° C., allowing the copper material to cool to a temperature from about 325° C. to about 350° C. to form a cooled copper material, and extruding the cooled copper material with equal channel angular extrusion to form a cooled copper manganese alloy.