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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10759935 B1

PDFFull Text
Date of Patent:
Sep. 01, 2020

Filed:

Mar. 06, 2017

Resin composition and molded body

Applicant:

Daikin Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Kazuki Sakami, Osaka, JP;

Eiji Masuda, Osaka, JP;

Kazuya Kawahara, Osaka, JP;

Assignee:

DAIKIN INDUSTRIES, LTD., Osaka, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Nathan M Nutter

Int. Cl.
CPC ...
C08L 33/16 (2006.01); C08G 18/48 (2006.01); C08L 101/12 (2006.01); C08G 18/75 (2006.01); C08G 18/76 (2006.01); C08L 75/06 (2006.01); C08G 18/42 (2006.01); C08G 18/73 (2006.01); C08G 18/44 (2006.01); C08G 18/77 (2006.01); B29C 45/00 (2006.01); C08L 23/06 (2006.01); C08L 23/12 (2006.01); C08L 25/14 (2006.01); C08L 27/06 (2006.01); C08L 55/02 (2006.01); C08L 69/00 (2006.01); C08L 75/04 (2006.01); C08F 220/18 (2006.01);
U.S. Cl.
CPC ...
C08L 33/16 (2013.01); B29C 45/0001 (2013.01); C08G 18/4277 (2013.01); C08G 18/44 (2013.01); C08G 18/4825 (2013.01); C08G 18/4833 (2013.01); C08G 18/4837 (2013.01); C08G 18/4854 (2013.01); C08G 18/73 (2013.01); C08G 18/751 (2013.01); C08G 18/755 (2013.01); C08G 18/758 (2013.01); C08G 18/7621 (2013.01); C08G 18/7671 (2013.01); C08G 18/7678 (2013.01); C08G 18/771 (2013.01); C08L 23/06 (2013.01); C08L 23/12 (2013.01); C08L 25/14 (2013.01); C08L 27/06 (2013.01); C08L 55/02 (2013.01); C08L 69/00 (2013.01); C08L 75/04 (2013.01); C08L 75/06 (2013.01); C08L 101/12 (2013.01); C08F 220/1818 (2020.02);
Abstract

Provided is a molded body of a resin composition, which has improved easy wiping-off properties and scratch resistance. This resin composition contains (1) a thermoplastic resin and (2) a fluorine-containing copolymer; and the fluorine-containing copolymer (2) is a copolymer which comprises (a) a repeating unit formed from a fluorine-containing monomer represented by formula CH═C(—X)—C(═O)—Y—Z—Rf, and (b) a repeating unit formed from a non-fluorine monomer having a hydrocarbon group with 14 or more carbon atoms, and which has a weight average molecular weight of 2,500-20,000.

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Sakami, Kazuki. (2020). Resin composition and molded body (U.S. Patent No. 10759935). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10759935

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