The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Sep. 30, 2014
Applicant:

Taiyo Ink Mfg. Co., Ltd., Hiki-gun, JP;

Inventors:

Masayuki Shimura, Hiki-gun, JP;

Yoshiyuki Furuta, Hiki-gun, JP;

Masao Yumoto, Hiki-gun, JP;

Assignee:

TAIYO INK MFG. CO., LTD., Hiki-gun, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 287/00 (2006.01); C09D 4/06 (2006.01); C08G 18/63 (2006.01); C08F 2/48 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
C08F 287/00 (2013.01); C08F 2/48 (2013.01); C08G 18/633 (2013.01); C08G 18/637 (2013.01); C09D 4/06 (2013.01); H05K 3/287 (2013.01); H05K 2203/013 (2013.01);
Abstract

Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.


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