The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Apr. 14, 2017
Applicant:

Ce Pharm Co., Ltd., Taizhou, CN;

Inventors:

Dawei Ma, Shanghai, CN;

Wei Zhou, Shanghai, CN;

Mengyang Fan, Shanghai, CN;

Haibo Wu, Shanghai, CN;

Junli Yin, Shanghai, CN;

Xi Jiang, Shanghai, CN;

Yuntong Zhai, Shanghai, CN;

Songtao Niu, Shanghai, CN;

Assignee:

CE Pharm Co., Ltd., Taizhou, Zhejiang Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07D 241/02 (2006.01); B01J 31/22 (2006.01); C07C 231/02 (2006.01); C07C 233/00 (2006.01); C07D 207/32 (2006.01); C07D 209/08 (2006.01); C07D 209/12 (2006.01); C07D 213/06 (2006.01); C07D 235/08 (2006.01); C07D 239/02 (2006.01); C07D 277/02 (2006.01); C07D 277/62 (2006.01); C07D 307/02 (2006.01); C07D 307/78 (2006.01); C07C 209/60 (2006.01);
U.S. Cl.
CPC ...
C07D 241/02 (2013.01); B01J 31/22 (2013.01); C07C 231/02 (2013.01); C07C 233/00 (2013.01); C07D 207/32 (2013.01); C07D 209/08 (2013.01); C07D 209/12 (2013.01); C07D 213/06 (2013.01); C07D 235/08 (2013.01); C07D 239/02 (2013.01); C07D 277/02 (2013.01); C07D 277/62 (2013.01); C07D 307/02 (2013.01); C07D 307/78 (2013.01); C07C 209/60 (2013.01);
Abstract

Provided are a heterocyclic carboxylic acid amide ligand and applications thereof in a copper catalyzed coupling reaction. Specifically, provided are uses of a compound represented by formula (I), definitions of radical groups being described in the specifications. The compound represented by formula (I) can be used as the ligand in the copper catalyzed coupling reaction of the aryl halogeno substitute, and is used or catalyzing the coupling reaction for forming the aryl halogeno substitute having C—N, C—O, C—S and other bonds.


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