The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Dec. 06, 2018
Applicant:

The Procter & Gamble Company, Cincinnati, OH (US);

Inventors:

James W. Busch, Maineville, OH (US);

Jennifer L. Schallick, Guilford, IN (US);

Stephen D. Congleton, Loveland, OH (US);

Dale F. Bittner, Harrison, OH (US);

Assignee:

The Procter & Gamble Company, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B32B 38/06 (2006.01); A61F 13/15 (2006.01); A61F 13/49 (2006.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B32B 37/0053 (2013.01); A61F 13/15699 (2013.01); A61F 13/15739 (2013.01); A61F 13/15764 (2013.01); A61F 13/49 (2013.01); B29C 65/02 (2013.01); B29C 66/21 (2013.01); B29C 66/234 (2013.01); B29C 66/45 (2013.01); B29C 66/81433 (2013.01); B29C 66/81453 (2013.01); B29C 66/83413 (2013.01); B29C 66/924 (2013.01); B32B 38/06 (2013.01); B33Y 80/00 (2014.12); A61F 2013/15715 (2013.01); A61F 2013/15861 (2013.01); B32B 2307/726 (2013.01); B32B 2555/02 (2013.01);
Abstract

A flexible bonding roll including one or more pressure applying members is configured to operatively engage an anvil roll. The one or more pressure applying members include one or more spring elements. The spring elements allow for the one or more pressure applying members to compress as the pressure applying members are engaged by the outer circumferential surface of the anvil roll. The compression of the pressure applying members allows for relatively reduced damage of substrates and equipment during bonding.


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