The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Nov. 30, 2018
Applicant:
Dow Global Technologies Llc, Midland, MI (US);
Inventors:
Jeffrey E Bonekamp, Midland, MI (US);
Yushan Hu, Pearland, TX (US);
Nichole E. Nickel, Midland, MI (US);
Lih-Long Chu, Midland, MI (US);
John A. Naumovitz, Midland, MI (US);
Mark G. Hofius, Midland, MI (US);
Assignee:
dow global technologies llc, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/32 (2006.01); H01L 31/049 (2014.01); H01L 31/048 (2014.01); C08L 53/00 (2006.01); B32B 27/08 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
B32B 27/32 (2013.01); B32B 27/08 (2013.01); B32B 27/327 (2013.01); C08L 53/00 (2013.01); H01L 31/049 (2014.12); H01L 31/0481 (2013.01); H01L 31/18 (2013.01); B32B 2250/242 (2013.01); B32B 2307/704 (2013.01); B32B 2457/12 (2013.01); Y02E 10/50 (2013.01);
Abstract
A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.