The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Dec. 08, 2016
Applicant:
Toyo Seikan Co., Ltd., Shinagawa-ku, Tokyo, JP;
Inventors:
Takahiro Yasuumi, Yokohama, JP;
Madoka Yamaguchi, Yokohama, JP;
Yasushi Hatano, Tokyo, JP;
Kouji Kuriyama, Yokohama, JP;
Assignee:
TOYO SEIKAN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B31B 70/00 (2017.01); B29C 43/00 (2006.01); B29C 59/00 (2006.01); B31F 1/00 (2006.01); B32B 7/00 (2019.01); B32B 27/00 (2006.01); B65D 1/00 (2006.01); B65D 33/00 (2006.01); B65D 65/00 (2006.01); B31B 70/88 (2017.01); B31F 1/07 (2006.01); B65D 65/40 (2006.01); B31B 70/74 (2017.01); B29C 59/02 (2006.01); B29C 43/46 (2006.01); B29C 59/04 (2006.01); B29C 43/52 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B65D 1/28 (2006.01); B65D 33/16 (2006.01);
U.S. Cl.
CPC ...
B31B 70/88 (2017.08); B29C 43/46 (2013.01); B29C 43/52 (2013.01); B29C 59/026 (2013.01); B29C 59/046 (2013.01); B31B 70/74 (2017.08); B31B 70/76 (2017.08); B31F 1/07 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/36 (2013.01); B65D 1/28 (2013.01); B65D 33/00 (2013.01); B65D 33/1691 (2013.01); B65D 65/40 (2013.01); B29C 2043/463 (2013.01); B32B 2323/10 (2013.01); B32B 2439/46 (2013.01);
Abstract
A method for three-dimensionally forming a resin packaging member. The resin packaging member is heated to a temperature not higher than the Vicat softening temperature of the packaging member, and then compression shaping is conducted at a temperature not lower than room temperature and not higher than the Vicat softening temperature so as to form a three-dimensionally shaped portion with a large protrusion.