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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10759134 B1

PDFFull Text
Date of Patent:
Sep. 01, 2020

Filed:

Dec. 08, 2016

Method for three-dimensionally shaping resin packaging member, and resin packaging member

Applicant:

Toyo Seikan Co., Ltd., Shinagawa-ku, Tokyo, JP;

Inventors:

Takahiro Yasuumi, Yokohama, JP;

Madoka Yamaguchi, Yokohama, JP;

Yasushi Hatano, Tokyo, JP;

Kouji Kuriyama, Yokohama, JP;

Assignee:

TOYO SEIKAN CO., LTD., Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Jacob T Minskey

Assistant Examiner:

Matthew Hoover

Int. Cl.
CPC ...
B31B 70/00 (2017.01); B29C 43/00 (2006.01); B29C 59/00 (2006.01); B31F 1/00 (2006.01); B32B 7/00 (2019.01); B32B 27/00 (2006.01); B65D 1/00 (2006.01); B65D 33/00 (2006.01); B65D 65/00 (2006.01); B31B 70/88 (2017.01); B31F 1/07 (2006.01); B65D 65/40 (2006.01); B31B 70/74 (2017.01); B29C 59/02 (2006.01); B29C 43/46 (2006.01); B29C 59/04 (2006.01); B29C 43/52 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B65D 1/28 (2006.01); B65D 33/16 (2006.01);
U.S. Cl.
CPC ...
B31B 70/88 (2017.08); B29C 43/46 (2013.01); B29C 43/52 (2013.01); B29C 59/026 (2013.01); B29C 59/046 (2013.01); B31B 70/74 (2017.08); B31B 70/76 (2017.08); B31F 1/07 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/36 (2013.01); B65D 1/28 (2013.01); B65D 33/00 (2013.01); B65D 33/1691 (2013.01); B65D 65/40 (2013.01); B29C 2043/463 (2013.01); B32B 2323/10 (2013.01); B32B 2439/46 (2013.01);
Abstract

A method for three-dimensionally forming a resin packaging member. The resin packaging member is heated to a temperature not higher than the Vicat softening temperature of the packaging member, and then compression shaping is conducted at a temperature not lower than room temperature and not higher than the Vicat softening temperature so as to form a three-dimensionally shaped portion with a large protrusion.

Find Patent Forward Citations

Yasuumi, Takahiro. (2020). Method for three-dimensionally shaping resin packaging member, and resin packaging member (U.S. Patent No. 10759134). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10759134

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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