The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Apr. 13, 2018
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
The present invention effects a reduction in production cost and increases yield of a transparent resin molded article and prevents the generation of defects such as bubbles, weld lines, and sink marks. This injection molding device (A) for a transparent resin molded article is equipped with: a die () for injection molding the transparent resin molded article; and a gate () that is provided to the peripheral edge of the die () and that is the inlet through which a resin material (R) is injected into the die (). The thickness dimensions (Ta) of the die () are in the range of 15-25 mm, and the ratio of the diameter dimensions (D) of the gate () to the thickness dimensions (Ta) of the die () is set in the range of 1:6 to 1:3.