The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

May. 17, 2017
Applicants:

Amada Holdings Co., Ltd., Kanagawa, JP;

Nisshin Steel Co., Ltd., Tokyo, JP;

Inventors:

Hideo Hara, Kanagawa, JP;

Masahito Ito, Kanagawa, JP;

Masanori Uehara, Kanagawa, JP;

Hiroshi Asada, Tokyo, JP;

Hirokazu Sasaki, Tokyo, JP;

Hiroshi Horikawa, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2014.01); B23K 26/046 (2014.01); B23K 26/40 (2014.01); B23K 26/08 (2014.01); B23K 26/14 (2014.01); B23K 103/04 (2006.01); B23K 101/34 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B23K 26/38 (2013.01); B23K 26/046 (2013.01); B23K 26/0853 (2013.01); B23K 26/14 (2013.01); B23K 26/1436 (2015.10); B23K 26/1464 (2013.01); B23K 26/1482 (2013.01); B23K 26/40 (2013.01); B23K 2101/34 (2018.08); B23K 2103/04 (2018.08); B23K 2103/172 (2018.08);
Abstract

A laser cutting and machining method for plated steel plated, when irradiating a laser beam LB on to the upper surface of a plated steel plate W and laser cutting and machining same: a plating layer-containing metal that has been melted and/or evaporated by the irradiation of the laser beam LB is caused to flow on to a cut surface of the plated steel plate W as a result of assist gas that is jetted towards a laser machining units; and the plating layer-containing metal is coated on the cut surface.


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