The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Nov. 16, 2017
Applicant:
Ut-battelle, Llc, Oak Ridge, TN (US);
Inventors:
Ramesh R. Bhave, Knoxville, TN (US);
Nicholas N. Linneen, Knoxville, TN (US);
Assignee:
UT-Battelle, LLC, Oak Ridge, TN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 53/22 (2006.01); B01D 71/02 (2006.01); B01D 71/40 (2006.01); B01D 69/10 (2006.01); B01J 29/00 (2006.01); B01D 69/12 (2006.01); B01D 67/00 (2006.01); B01D 69/02 (2006.01);
U.S. Cl.
CPC ...
B01D 71/028 (2013.01); B01D 53/228 (2013.01); B01D 67/0067 (2013.01); B01D 69/10 (2013.01); B01D 69/12 (2013.01); B01D 69/125 (2013.01); B01D 71/021 (2013.01); B01D 71/40 (2013.01); B01J 29/00 (2013.01); B01D 69/02 (2013.01); B01D 71/024 (2013.01); B01D 2256/10 (2013.01); B01D 2256/12 (2013.01); B01D 2256/16 (2013.01); B01D 2256/18 (2013.01); B01D 2256/24 (2013.01); B01D 2256/245 (2013.01); B01D 2257/102 (2013.01); B01D 2257/104 (2013.01); B01D 2257/108 (2013.01); B01D 2257/11 (2013.01); B01D 2257/504 (2013.01); B01D 2257/7022 (2013.01); B01D 2257/7025 (2013.01); B01D 2325/04 (2013.01);
Abstract
An ultrathin high permselectivity carbon molecular sieve membrane (CMSM) for industrial gas separations is provided. The CMSM includes porous metal or ceramic supports to provide superior stability at high temperatures, pressures and chemical environments. The CMSM also offers the potential for cost-effective gas processing while overcoming disadvantages found in alternative media that are fragile and susceptible to shock due to thermal cycling and prone to end-sealing problems under industrial conditions.