The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Nov. 20, 2018
Shih-hsiung Yen, Taipei, TW;
Chia-hung Ou, Taipei, TW;
Ta-hsiang Huang, Taipei, TW;
June-peng Lai, Taipei, TW;
Fu-hsuan Tseng, Taipei, TW;
Ching-tai Chang, Taipei, TW;
Shih-Hsiung Yen, Taipei, TW;
Chia-Hung Ou, Taipei, TW;
Ta-Hsiang Huang, Taipei, TW;
June-Peng Lai, Taipei, TW;
Fu-Hsuan Tseng, Taipei, TW;
Ching-Tai Chang, Taipei, TW;
COMPAL ELECTRONICS, INC., Taipei, TW;
Abstract
A floor mat structure includes an upper cover, a plurality of light bars, a lower cover and at least one sensing element. The upper cover includes a main body and a plurality of indicator blocks. The main body has an upper surface and a lower surface opposite to each other. The indicator blocks are separated from one another and are disposed on the lower surface. The light bars are disposed on the upper cover and are embedded in the upper surface. The lower cover assembled to the upper cover includes a base and a plurality of bumps. The base has a configuration surface facing the lower surface. The bumps are separated from one another and are disposed on the configuration surface, wherein orthographic projections of the indicator blocks on the configuration surface does not overlap the bumps. The sensing element is disposed on the lower cover and are located at at least one bump. When the sensing element senses pressure from the upper cover, the light bars illuminate. Also, a floor mat assembly is provided.