The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Dec. 28, 2018
Applicant:
Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka-shi, Osaka, JP;
Inventor:
Masahiro Watanabe, Kizugawa, JP;
Assignee:
Tatsuta Electric Wire & Cable Co., Ltd., Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/06 (2006.01); H05K 3/38 (2006.01); H05K 9/00 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0084 (2013.01); H05K 1/0216 (2013.01); H05K 9/0081 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0358 (2013.01); H05K 2203/1178 (2013.01);
Abstract
An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/mper 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.