The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10757814 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 25, 2020

Filed:

Apr. 26, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventor:

Nobuhiko Nakamura, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/184 (2013.01); H05K 1/183 (2013.01); H05K 3/306 (2013.01); H05K 3/3447 (2013.01); H05K 3/3468 (2013.01); H05K 1/182 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/0169 (2013.01); H05K 2203/044 (2013.01);
Abstract

A circuit board manufacturing method which includes inserting either a first claw or a second claw through a notch formed by notching an edge of a hole of a wiring board. The first claw and the second claw project outward from a wall portion of a cover member. The cover member is held on the wiring board, by sliding the cover member relative to the wiring board to position the edge of the hole between the first claw and the second claw provided on a surface of the wall portion identical to a surface on which the first claw is provided. The cover member is detached from the wiring board, by sliding the cover member relative to the wiring board to shift the first claw from the component mounting surface side to a soldering surface side with the first claw passing through the notch.


Find Patent Forward Citations

Nakamura, Nobuhiko. (2020). Method for manufacturing a circuit board (U.S. Patent No. 10757814). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10757814

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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