The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

May. 06, 2019
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Ken Yamamoto, Tokyo, JP;

Takuro Suyama, Tokyo, JP;

Takahiro Shimohata, Tokyo, JP;

Takatoshi Igarashi, Tokyo, JP;

Hiroshi Kobayashi, Tokyo, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/04 (2006.01); H04N 5/225 (2006.01); A61B 1/05 (2006.01); H01L 27/146 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H04N 5/369 (2011.01); H01L 27/14 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2252 (2013.01); A61B 1/04 (2013.01); A61B 1/051 (2013.01); H01L 25/065 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 27/14 (2013.01); H01L 27/14634 (2013.01); H04N 5/2253 (2013.01); H04N 5/369 (2013.01); H04N 2005/2255 (2013.01);
Abstract

An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.


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