The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Sep. 12, 2018
Applicant:

Integrated Device Technology, Inc., San Jose, CA (US);

Inventors:

Tumay Kanar, San Diego, CA (US);

Chih-Hsiang Ko, San Diego, CA (US);

Samet Zihir, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 21/00 (2006.01); H04B 1/44 (2006.01); H03F 1/56 (2006.01); H03F 3/19 (2006.01); H03G 3/30 (2006.01); H03F 3/24 (2006.01); H03F 1/32 (2006.01); H03F 3/195 (2006.01); H03F 3/45 (2006.01); H03F 3/68 (2006.01); H04B 1/04 (2006.01); H04B 1/18 (2006.01); H04B 1/48 (2006.01); H03K 21/10 (2006.01); H04B 7/06 (2006.01); H01Q 1/52 (2006.01); H01Q 3/28 (2006.01); H01Q 3/36 (2006.01); H01Q 19/30 (2006.01); H01Q 21/06 (2006.01); H03F 1/02 (2006.01); H01Q 1/48 (2006.01); H01Q 1/22 (2006.01); H03H 7/48 (2006.01); H04B 1/401 (2015.01);
U.S. Cl.
CPC ...
H01Q 21/0006 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01); H01Q 1/523 (2013.01); H01Q 1/526 (2013.01); H01Q 3/28 (2013.01); H01Q 3/36 (2013.01); H01Q 19/30 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/062 (2013.01); H01Q 21/065 (2013.01); H03F 1/0211 (2013.01); H03F 1/0261 (2013.01); H03F 1/3282 (2013.01); H03F 1/565 (2013.01); H03F 3/19 (2013.01); H03F 3/195 (2013.01); H03F 3/245 (2013.01); H03F 3/45089 (2013.01); H03F 3/45475 (2013.01); H03F 3/68 (2013.01); H03G 3/3042 (2013.01); H03H 7/487 (2013.01); H03K 21/10 (2013.01); H04B 1/0458 (2013.01); H04B 1/18 (2013.01); H04B 1/401 (2013.01); H04B 1/44 (2013.01); H04B 1/48 (2013.01); H04B 7/0617 (2013.01); H03F 2200/294 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01);
Abstract

An apparatus includes a package and a beam former circuit. The package may be configured to be mounted on an antenna array at a center of four antenna elements. The beam former circuit may (i) be disposed in the package, (ii) have a plurality of ports, (iii) be configured to generate a plurality of radio-frequency signals in the ports while in a transmit mode and (iv) be configured to receive the radio-frequency signals at the ports while in a receive mode. A plurality of ground bumps may be disposed between the beam former circuit and the package. The ground bumps may be positioned to bracket each port. Each ground bump may be electrically connected to a signal ground to create a radio-frequency shielding between neighboring ports.


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