The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Apr. 13, 2017
Applicant:
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Inventors:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS, LTD., Ibaraki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/42 (2006.01); H01Q 1/52 (2006.01); H01Q 13/02 (2006.01); H01Q 19/06 (2006.01); H01P 3/08 (2006.01); H01Q 23/00 (2006.01); H01Q 13/08 (2006.01); H01P 5/08 (2006.01); H01P 5/107 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/526 (2013.01); H01P 3/08 (2013.01); H01P 5/08 (2013.01); H01P 5/107 (2013.01); H01Q 1/42 (2013.01); H01Q 13/02 (2013.01); H01Q 13/08 (2013.01); H01Q 19/06 (2013.01); H01Q 23/00 (2013.01); H05K 9/00 (2013.01);
Abstract
Proposed is a millimeter-wave band communication device which does not generate spatial resonance in a cover shielding unnecessary radio waves from the outside. Disclosed is a millimeter-wave band communication device including: a substrate; a radio frequency circuit element for a millimeter-wave band provided on the substrate; and a cover made of a bulk material that covers at least a part of the radio frequency circuit element and a surface of the substrate, the cover being formed by blending a dielectric loss material in a base.