The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Oct. 01, 2018
Boe Technology Group Co., Ltd., Beijing, CN;
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;
Wenbin Jia, Beijing, CN;
Huifeng Wang, Beijing, CN;
Chinlung Liao, Beijing, CN;
Feifei Zhu, Beijing, CN;
Xiang Wan, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., Anhui, CN;
Abstract
A method of fabricating a substrate includes forming a planarization layer, and forming the planarization layer includes: forming a first planarization sub-layer on a base substrate on which a patterned film layer has been formed. A surface of the first planarization sub-layer facing away from the base substrate has a plurality of depressed portions. Forming the planarization layer further includes: forming a second planarization sub-layer at multiple depressed portions of the plurality of the depressed portions to obtain the planarization layer including the first planarization sub-layer and the second planarization sub-layer. A flatness of a surface of the planarization layer is higher than a flatness of the surface of the first planarization sub-layer.