The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Aug. 16, 2018
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Hidemasa Oshige, Yokohama, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G05D 1/02 (2020.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H01L 31/022408 (2013.01); G05D 1/0246 (2013.01); H01L 27/14643 (2013.01);
Abstract
A semiconductor device disclosed includes a semiconductor substrate, an electrode layer arranged over the semiconductor substrate, and a conductive member provided in an opening and electrically connected to the electrode layer, and the opening penetrates the semiconductor substrate and reaches the electrode layer. The conductive member includes a metal portion and a barrier metal portion provided between a side surface of the opening and the metal portion, the barrier metal portion includes a first layer and a second layer provided between the first layer and the metal portion, and the second layer is denser than the first layer.