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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10756123 B1

PDFFull Text
Date of Patent:
Aug. 25, 2020

Filed:

Apr. 11, 2018

Electrostatic discharge circuit and manufacturing method therefor, and display apparatus

Applicants:

Beijing Boe Display Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yang Li, Beijing, CN;

Shuo Tang, Beijing, CN;

Ying Meng, Beijing, CN;

Bin Feng, Beijing, CN;

Peng Sun, Beijing, CN;

Assignees:

BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., Beijing, CN;

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

Attorney:

Leason Ellis LLP

Primary Examiner:

Joseph C Nicely

Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 23/498 (2006.01); H01L 23/60 (2006.01); H01L 27/02 (2006.01); H01L 23/522 (2006.01); H01L 23/48 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 21/76802 (2013.01); H01L 21/76816 (2013.01); H01L 21/76877 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5226 (2013.01); H01L 23/60 (2013.01); H01L 27/0248 (2013.01); H01L 27/0288 (2013.01); H01L 27/1244 (2013.01); H01L 2224/8211 (2013.01);
Abstract

An electrostatic discharge circuit and a manufacturing method therefor, and a display apparatus. The electrostatic discharge circuit includes: a base substrate; at least one first signal line located on the base substrate, at least one second signal line and a first isolation layer, wherein the at least one first signal line and the at least one second signal line are insulated from each other by the first isolation layer; and a second isolation layer covering the at least one second signal line, wherein a via hole is provided on the at least one first signal line, the via hole penetrates through the first isolation layer and the second isolation layer so that the at least one first signal line is located at the bottom of the via hole, and a part of the via hole is enclosed by the at least one second signal line.

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