The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Mar. 19, 2019
Applicant:

Sharp Kabushiki Kaisha, Sakai, Osaka, JP;

Inventors:

Teruyuki Ueda, Sakai, JP;

Yoshihito Hara, Sakai, JP;

Tohru Daitoh, Sakai, JP;

Hajime Imai, Sakai, JP;

Hideki Kitagawa, Sakai, JP;

Masaki Maeda, Sakai, JP;

Tatsuya Kawasaki, Sakai, JP;

Yoshiharu Hirata, Sakai, JP;

Tetsuo Kikuchi, Sakai, JP;

Toshikatsu Itoh, Sakai, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/51 (2006.01); H01L 29/49 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1225 (2013.01); H01L 27/124 (2013.01); H01L 27/127 (2013.01); H01L 27/1218 (2013.01); H01L 29/4908 (2013.01); H01L 29/4958 (2013.01); H01L 29/518 (2013.01); H01L 29/7869 (2013.01);
Abstract

An active matrix substrate includes a gate metal layer including a plurality of gate bus lines, and a thin film transistor arranged in each pixel region, wherein: the thin film transistor includes a gate electrode, an oxide semiconductor layer arranged on the gate electrode with a gate insulating layer interposed therebetween, wherein the gate electrode is formed in the gate metal layer and is electrically connected to a corresponding one of the plurality of gate bus lines, the gate metal layer has a layered structure including a copper alloy layer and a copper layer arranged on the copper alloy layer, wherein the copper alloy layer is of a copper alloy including Cu and at least one additive metal element, wherein the additive metal element includes Al, and an Al content of the copper alloy is 2 at % or more and 8 at % or less.


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