The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Jan. 15, 2019
Toshiba Memory Corporation, Minato-ku, JP;
Yuki Uchida, Yokkaichi, JP;
Takeshi Watanabe, Yokkaichi, JP;
Ken Hayakawa, Yokkaichi, JP;
Ayana Amano, Nagoya, JP;
Yuki Sugo, Suzuka, JP;
Reishuku Ikebe, Yokkaichi, JP;
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Abstract
A semiconductor device according to an embodiment comprises a substrate and a first semiconductor chip provided above the substrate. A second semiconductor chip is provided above the first semiconductor chip. A spacer chip is provided between the first semiconductor chip and the second semiconductor chip with regard to a direction orthogonal to a mount surface of the substrate, the spacer chip being made of a first resin material. A first adhesive material is provided between the spacer chip and the substrate or the first semiconductor chip. A second adhesive material is provided between the spacer chip and the second semiconductor chip. A second resin material covers the first and second semiconductor chips and the spacer chip.