The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Sep. 19, 2017
Applicant:
E I Du Pont DE Nemours and Company, Wilmington, DE (US);
Inventor:
Takuya Konno, Kanagawa, JP;
Assignee:
E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); H01L 23/00 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B23K 35/025 (2013.01); B23K 35/3006 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83464 (2013.01); H01L 2224/83469 (2013.01); H01L 2224/83473 (2013.01); H01L 2924/014 (2013.01);
Abstract
The present invention relates to a conductive paste for bonding that comprises a metal powder and a solvent, wherein the metal powder comprises a first metal powder having a particle diameter (D50) of 10 to 150 nm and a second metal powder having a particle diameter (D50) of 151 to 500 nm. The paste is useful for manufacturing an electronic device comprising a substrate with an electrically conductive layer and an electrical or electronic component, which are reliably bonded together using the paste.