The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Jan. 24, 2018
Applicant:

Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Seung Hwa Ha, Yongin-si, KR;

Seung Soo Ryu, Yongin-si, KR;

Jeong Ho Hwang, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 21/67092 (2013.01); H01L 21/67144 (2013.01); H01L 21/6838 (2013.01); H01L 24/81 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75353 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81205 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/20301 (2013.01); H01L 2924/20302 (2013.01); H01L 2924/20303 (2013.01); H01L 2924/20304 (2013.01); H01L 2924/20305 (2013.01); H01L 2924/20306 (2013.01); H01L 2924/20307 (2013.01); H01L 2924/20308 (2013.01); H01L 2924/20309 (2013.01);
Abstract

A connecting device for connecting a circuit chip to a substrate is provided. The connecting device includes: a main body having a first opening and a second opening; a vibration part on the main body, the vibration part being configured to vibrate the main body; and an intake part coupled with the first and second openings to adsorb the circuit chip to the main body. Both the first and second openings are open at a surface of the main body to which the circuit chip is adsorbed, and the second opening is arranged in the first opening on a plane.


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