The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Mar. 14, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Charles L. Arvin, Poughkeepsie, NY (US);

Brian M. Erwin, Millbrook, NY (US);

Clement J. Fortin, Quebec, CA;

Chris Muzzy, Burlington, VT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 24/11 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11474 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/1366 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13564 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/13655 (2013.01); H01L 2924/3841 (2013.01);
Abstract

A finned contact of an IC device may be utilized to electrically connect the IC device to external circuitry. The finned contact may be fabricated by forming a base upon the IC device and subsequently forming two or more fins upon the base. Each fin may be formed of the same and/or different material(s) as the base. Each fin may include layer(s) of one or materials. The fins may be located upon the base inset from the sidewall(s) of the base. The fins may be arranged as separated ring portions that are concentric with the base. The fins may drive current into the external circuitry connected thereto. Solder may be drawn towards the center of the base within an inner void that is internal to the fins, thereby limiting the likelihood of solder bridging with a neighboring contact.


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