The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Mar. 16, 2017
Applicant:

Agency for Science, Technology and Research, Singapore, SG;

Inventors:

David Ho, Singapore, SG;

Vempati Srinivasa Rao, Singapore, SG;

Tai Chong Chai, Singapore, SG;

Surya Bhattacharya, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01); H01L 24/16 (2013.01); H01L 25/00 (2013.01); H01L 21/561 (2013.01); H01L 24/13 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01);
Abstract

Various embodiments may provide an electrical connection structure. The electrical connection structure may include a first substrate having a first surface defining a cavity, and an inner wall defining a via extending from the cavity. The electrical connection structure may also include an interconnect structure provided in the via so that at least a portion of the interconnect structure protrudes into the cavity. The electrical connection structure may further include a second substrate having a second surface facing the first surface. The electrical connection structure may additionally include a connection element on the second surface. At least a portion of the connection element may be received in the cavity so that the connection element is in electrical connection with the interconnect structure.


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