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For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10755992 B1

PDFFull Text
Date of Patent:
Aug. 25, 2020

Filed:

May. 30, 2018

Wafer-level packaging for enhanced performance

Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Julio C. Costa, Oak Ridge, NC (US);

Merrill Albert Hatcher, Jr., Greensboro, NC (US);

Peter V. Wright, Portland, OR (US);

Jon Chadwick, Greensboro, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:

Withrow & Terranova, P.L.L.C.

Primary Examiner:

Luan C Thai

Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/3105 (2006.01); H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 23/29 (2006.01); H01L 21/78 (2006.01); H01L 21/762 (2006.01); H01L 23/367 (2006.01); H01L 21/311 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/31058 (2013.01); H01L 21/31133 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/76256 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 23/3135 (2013.01); H01L 23/3171 (2013.01); H01L 23/367 (2013.01); H01L 23/50 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 23/544 (2013.01); H01L 24/13 (2013.01); H01L 24/94 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/20641 (2013.01); H01L 2924/20642 (2013.01); H01L 2924/20643 (2013.01);
Abstract

The present disclosure relates to a mold module that includes a device layer, a number of first bump structures, a first mold compound, a stop layer, and a second mold compound. The device layer includes a number of input/output (I/O) contacts at a top surface of the device layer. Each first bump structure is formed over the device layer and electronically coupled to a corresponding I/O contact. The first mold compound resides over the device layer, and a portion of each first bump structure is exposed through the first mold compound. The stop layer is formed underneath the device layer. The second mold compound resides underneath the stop layer, such that the stop layer separates the device layer from the second mold compound.

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