The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Jan. 05, 2018
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Sang Youl Lee, Seoul, KR;

Chung Song Kim, Seoul, KR;

Ji Hyung Moon, Seoul, KR;

Sun Woo Park, Seoul, KR;

Hyeon Min Cho, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/268 (2006.01); H01L 21/52 (2006.01); H01L 27/15 (2006.01); H05B 33/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/268 (2013.01); H01L 21/52 (2013.01); H01L 27/15 (2013.01); H05B 33/10 (2013.01);
Abstract

An embodiment provides a display device manufacturing method comprising the steps of: preparing a substrate having a plurality of semiconductor chips arranged thereon (S); bonding at least one first semiconductor chip of the plurality of semiconductor chips to a transfer member (S); irradiating laser light to the first semiconductor chip to separate the first semiconductor chip from the substrate (S); disposing the first semiconductor chip on a panel substrate of a display device by means of the transfer member (S); and irradiating light to the transfer member to separate the first semiconductor chip from the transfer member (S), wherein the transfer member comprises: a transfer layer and a bonding layer disposed on one surface of the transfer layer; the bonding layer comprises at least one bonding protrusion; and the first semiconductor chip is bonded to the bonding protrusion in step S


Find Patent Forward Citations

Loading…