The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Mar. 26, 2018
Applicant:

Duke University, Durham, NC (US);

Inventors:

Jungsang Kim, Chapel Hill, NC (US);

Kai Hudek, Durham, NC (US);

Geert Vrijsen, Durham, NC (US);

Robert Spivey, Durham, NC (US);

Peter Maunz, Durham, NC (US);

Assignee:

Duke University, Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 49/42 (2006.01); G06N 10/00 (2019.01); H01J 49/16 (2006.01); H01J 49/24 (2006.01);
U.S. Cl.
CPC ...
H01J 49/422 (2013.01); G06N 10/00 (2019.01); H01J 49/16 (2013.01); H01J 49/24 (2013.01); H01J 49/42 (2013.01);
Abstract

A package-level, integrated high-vacuum ion-chip enclosure having improved thermal characteristics is disclosed. Enclosures in accordance with the present invention include first and second chambers that are located on opposite sides of a chip carrier, where the chambers are fluidically coupled via a conduit through the chip carrier. The ion trap is located in the first chamber and disposed on the chip carrier. A source for generating an atomic flux is located in the second chamber. The separation of the source and ion trap in different chambers affords thermal isolation between them, while the conduit between the chambers enables the ion trap to receive the atomic flux.


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