The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Apr. 27, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Toan Tran, San Jose, CA (US);

Laksheswar Kalita, San Jose, CA (US);

Tae Won Kim, San Jose, CA (US);

Dmitry Lubomirsky, Cupertino, CA (US);

Xiaowei Wu, San Jose, CA (US);

Xiao-Ming He, Freemont, CA (US);

Cheng-Hsuan Chou, Santa Clara, CA (US);

Jennifer Y. Sun, Mountain View, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/40 (2006.01); H01J 37/32 (2006.01); C23C 16/02 (2006.01); C23C 28/04 (2006.01); C23C 16/455 (2006.01); C23C 16/04 (2006.01); C23C 16/44 (2006.01); C23C 24/04 (2006.01); C23C 18/36 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32495 (2013.01); C23C 16/0254 (2013.01); C23C 16/04 (2013.01); C23C 16/40 (2013.01); C23C 16/403 (2013.01); C23C 16/4404 (2013.01); C23C 16/45544 (2013.01); C23C 16/45565 (2013.01); C23C 24/04 (2013.01); C23C 28/042 (2013.01); H01J 37/32477 (2013.01); C23C 16/45525 (2013.01); C23C 18/36 (2013.01); C25D 7/123 (2013.01); H01J 2237/0203 (2013.01);
Abstract

A method of applying a multi-layer plasma resistant coating on an article comprises performing plating or ALD to form a conformal first plasma resistant layer on an article, wherein the conformal first plasma resistant layer is formed on a surface of the article and on walls of high aspect ratio features in the article. The conformal first plasma resistant coating has a porosity of approximately 0% and a thickness of approximately 200 nm to approximately 1 micron. One of electron beam ion assisted deposition (EB-IAD), plasma enhanced chemical vapor deposition (PECVD), aerosol deposition or plasma spraying is then performed to form a second plasma resistant layer that covers the conformal first plasma resistant layer at a region of the surface but not at the walls of the high aspect ratio features.


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