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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10755740 B1

PDFFull Text
Date of Patent:
Aug. 25, 2020

Filed:

Sep. 26, 2019

Spindle motor

Applicant:

Minebea Mitsumi Inc., Nagano, JP;

Inventors:

Hideaki Showa, Nagano, JP;

Daigo Nakajima, Tomi, JP;

Tetsuo Kitamura, Nagano, JP;

Assignee:

MINEBEA MITSUMI INC., Nagano, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

William J Klimowicz

Int. Cl.
CPC ...
G11B 19/20 (2006.01); G11B 5/48 (2006.01); G11B 33/14 (2006.01); G11B 33/12 (2006.01); H02K 3/50 (2006.01); H02K 5/10 (2006.01); H02K 5/22 (2006.01); H02K 11/00 (2016.01); G11B 25/04 (2006.01);
U.S. Cl.
CPC ...
G11B 19/2009 (2013.01); G11B 5/4806 (2013.01); G11B 33/122 (2013.01); G11B 33/1466 (2013.01); H02K 3/50 (2013.01); H02K 5/10 (2013.01); H02K 5/225 (2013.01); H02K 11/00 (2013.01); G11B 19/2036 (2013.01); G11B 25/043 (2013.01); H02K 2203/03 (2013.01); H02K 2211/03 (2013.01);
Abstract

A spindle motor includes a base plate in which a through hole is formed, a stator core that is provided inside the base plate and is wound with a coil, and a circuit board that is provided outside the base plate and to which a conducting wire of the coil drawn out to outside through the through hole is connected, wherein the through hole includes an inner opening that opens inward of the base plate, an outer opening that opens outward of the base plate, and an intermediate portion having a cylindrical shape that is provided between the inner opening and the outer opening, an enlarged opening is formed to be connected to the outer opening, the enlarged opening is offset to extend toward a side where the circuit board is not present, and the through hole is sealed with a sealing material.

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