The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Dec. 16, 2016
D-wave Systems Inc., Burnaby, CA;
Alexandr M. Tcaciuc, New Westminster, CA;
Pedro A. de Buen, Coquitlam, CA;
Peter D. Spear, Burnaby, CA;
Sergey V. Uchaykin, Vancouver, CA;
Colin C. Enderud, Vancouver, CA;
Richard D. Neufeld, Burnaby, CA;
Jeremy P. Hilton, Vancouver, CA;
J. Craig Petroff, Burnaby, CA;
Amar B. Kamdar, Burnaby, CA;
Gregory D. Peregrym, Port Moody, CA;
Edmond Ho Yin Kan, Burnaby, CA;
Loren J. Swenson, Burnaby, CA;
George E. G. Sterling, Vancouver, CA;
Gregory Citver, Richmond, CA;
D-WAVE SYSTEMS INC., Burnaby, CA;
Abstract
An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.