The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Mar. 08, 2019
Applicant:

Horiba Stec, Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Koutaro Takijiri, Kyoto, JP;

Kentaro Nagai, Kyoto, JP;

Yuko Imasato, Kyoto, JP;

Tsai Wei Tseng, Kyoto, JP;

Kazuhiro Matsuura, Kyoto, JP;

Assignee:

HORIBA STEC, Co., Ltd., Kyoto-shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05D 7/06 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G05D 7/0635 (2013.01); H01L 21/67017 (2013.01);
Abstract

In order to provide a flow rate control apparatus that estimates a flow rate actually flowing at a control point without a large amount of noise, there are provided a fluid resistor that is provided on a flow path, a downstream-side valve that is provided on a downstream side of the fluid resistor, a resistance flow rate measurement mechanism that measures a resistance flow rate that flows through the fluid resistor, and flows into a volumetric space located on the flow path between this fluid resistor and the downstream-side valve, a subject flow rate estimation part that estimates a valve flow rate based on the flow rate characteristics stored in the flow rate characteristics storage part, and a flow rate control unit that controls the downstream-side valve based on a set flow rate, and on the valve flow rate estimated by the subject flow rate estimation part.


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