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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10754251 B1

PDFFull Text
Date of Patent:
Aug. 25, 2020

Filed:

Feb. 03, 2017

Development unit, substrate processing apparatus, development method and substrate processing method

Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Yuji Tanaka, Kyoto, JP;

Masaya Asai, Kyoto, JP;

Masahiko Harumoto, Kyoto, JP;

Koji Kaneyama, Kyoto, JP;

Assignee:

SCREEN Holdings Co., Ltd., , JP;

Attorney:

Ostrolenk Faber LLP

Primary Examiner:

Rodney E Fuller

Int. Cl.
CPC ...
G03D 5/00 (2006.01); G03F 7/32 (2006.01); G03F 7/30 (2006.01); H01L 21/67 (2006.01); H01L 21/027 (2006.01); G03F 7/16 (2006.01); H01L 21/677 (2006.01); G03F 7/004 (2006.01); G03F 7/40 (2006.01); H01L 21/02 (2006.01); G03F 7/09 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/322 (2013.01); G03F 7/0044 (2013.01); G03F 7/091 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/2004 (2013.01); G03F 7/3057 (2013.01); G03F 7/325 (2013.01); G03F 7/40 (2013.01); G03F 7/70925 (2013.01); H01L 21/02057 (2013.01); H01L 21/0274 (2013.01); H01L 21/6715 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/67173 (2013.01); H01L 21/67178 (2013.01); H01L 21/67742 (2013.01);
Abstract

A substrate having a film of a coating liquid containing metal is held by a spin chuck, the film having been exposed in a predetermined pattern. A slit nozzle supplies a development liquid to a surface to be processed of the substrate supported by the spin chuck. A cleaning liquid for removing or dissolving metal is supplied by a cleaning nozzle to the surface to be processed of the substrate to which the development liquid has been supplied.

Find Patent Forward Citations

Tanaka, Yuji. (2020). Development unit, substrate processing apparatus, development method and substrate processing method (U.S. Patent No. 10754251). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10754251

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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