The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Jul. 18, 2019
Laser Institute of Shandong Academy of Science, Jining, CN;
Qilu University of Technology, Ji'nan, CN;
Yingying Wang, Ji'nan, CN;
Gangding Peng, Ji'nan, CN;
Chang Wang, Ji'nan, CN;
Jiasheng Ni, Ji'nan, CN;
Qingchao Zhao, Ji'nan, CN;
Faxiang Zhang, Ji'nan, CN;
Shaodong Jiang, Ji'nan, CN;
Long Ma, Ji'nan, CN;
Laser Institute of Shandong Academy of Science, Jining, CN;
Qilu University of Technology, Ji'nan, CN;
Abstract
An optical fiber flow sensor, including: a housing, an elastic component, an optical fiber detection component, a floating element, and a fixed sealing joint. The elastic component includes a first and second elastic members that are symmetrical and are disposed in a closely fitted manner, with fitting surfaces of the first and the second elastic members being respectively provided with a corresponding seating groove. The optical fiber detection component is disposed in the seating grooves, and both ends of the optical fiber detection component are welded in the seating grooves via a glass solder. The elastic component is enclosed in the housing, and one end of the housing is fixed at the fixed sealing joint. The optical fiber detection component is sealed within the elastic component so as to avoid direct contact with an external fluid, and prevent damage by corrosion, hydrogen loss, or the like. The optical fiber detection component is welded to the elastic component via a glass solder, thereby avoiding a high-temperature creep deformation of the glue and thermal mismatch.