The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Jan. 27, 2016
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventors:
Toshiaki Hasegawa, Kanagawa, JP;
Kenichi Aoyagi, Kanagawa, JP;
Yoshiya Hagimoto, Kanagawa, JP;
Nobutoshi Fujii, Kanagawa, JP;
Assignee:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); F21K 9/60 (2016.01); H01L 21/683 (2006.01); H01L 25/18 (2006.01); H01L 25/04 (2014.01); F21Y 113/13 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21K 9/60 (2016.08); H01L 21/6835 (2013.01); H01L 24/00 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/04 (2013.01); H01L 25/18 (2013.01); H05K 1/181 (2013.01); H05K 3/341 (2013.01); H05K 3/3436 (2013.01); H05K 3/3489 (2013.01); F21Y 2113/13 (2016.08); F21Y 2115/10 (2016.08); H01L 24/13 (2013.01); H01L 24/97 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/95136 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15192 (2013.01); H05K 2201/09909 (2013.01); H05K 2203/041 (2013.01); Y02P 70/613 (2015.11);
Abstract
An electronic component mounting substrateA is configured of an electronic component, and a mounting substratemounting the electronic componentthereon, in which concave partsare formed on a mounting surfaceof the electronic componentopposite to the mounting substrate, a connection partis exposed at the bottom of the concave part, and electronic component attachment partsprovided on the mounting substrateare soldered to the connection partsprovided in the electronic component