The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Jan. 27, 2017
Applicant:
Ntn Corporation, Osaka, JP;
Inventors:
Assignee:
NTN CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16C 33/12 (2006.01); B22F 3/16 (2006.01); B22F 3/24 (2006.01); B22F 5/10 (2006.01); H02K 5/167 (2006.01); H02K 7/08 (2006.01); H02K 21/22 (2006.01); G11B 19/20 (2006.01); F16C 17/10 (2006.01); F16C 33/14 (2006.01); F16C 33/10 (2006.01); B22F 5/00 (2006.01); C22C 9/00 (2006.01); B22F 1/00 (2006.01); C22C 38/00 (2006.01);
U.S. Cl.
CPC ...
F16C 33/121 (2013.01); B22F 1/00 (2013.01); B22F 3/16 (2013.01); B22F 3/24 (2013.01); B22F 5/00 (2013.01); B22F 5/106 (2013.01); C22C 9/00 (2013.01); C22C 38/00 (2013.01); F16C 17/10 (2013.01); F16C 33/10 (2013.01); F16C 33/104 (2013.01); F16C 33/128 (2013.01); F16C 33/145 (2013.01); G11B 19/2036 (2013.01); H02K 5/1677 (2013.01); H02K 7/086 (2013.01); H02K 21/22 (2013.01); B22F 2301/10 (2013.01); B22F 2301/35 (2013.01); B22F 2304/10 (2013.01); F16C 17/107 (2013.01); F16C 2204/10 (2013.01); F16C 2204/60 (2013.01); F16C 2220/20 (2013.01); F16C 2223/04 (2013.01); F16C 2240/48 (2013.01); F16C 2370/12 (2013.01); H02K 2205/03 (2013.01);
Abstract
An oil-impregnated sintered bearing () includes a copper-iron-based sintered compact containing 40 mass % or more of copper, and has inner pores impregnated with an oil. The sintered compact has: a copper structure derived from copper powder () of partially diffusion-alloyed powder () in which copper powder () having a particle diameter of 20 μm or less is diffused on and joined to a surface of iron powder () in advance; and a copper structure derived from elemental copper powder ().