The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Oct. 19, 2015
Applicant:

Sumitomo Metal Mining Co., Ltd., Tokyo, JP;

Inventor:

Hideharu Okami, Niihama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 3/06 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H01L 23/373 (2006.01); H01L 21/3065 (2006.01); H01L 21/306 (2006.01); H01L 21/263 (2006.01); H01L 21/02 (2006.01); G06F 3/044 (2006.01); C23C 14/58 (2006.01); C23C 14/56 (2006.01); C23C 14/54 (2006.01); C23C 14/20 (2006.01); C23C 14/08 (2006.01); C23C 14/06 (2006.01); C23C 14/00 (2006.01); B32B 15/08 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0089 (2013.01); B32B 15/08 (2013.01); C23C 14/0015 (2013.01); C23C 14/0057 (2013.01); C23C 14/06 (2013.01); C23C 14/085 (2013.01); C23C 14/205 (2013.01); C23C 14/548 (2013.01); C23C 14/562 (2013.01); C23C 14/5873 (2013.01); G06F 3/044 (2013.01); H01L 21/02296 (2013.01); H01L 21/2633 (2013.01); H01L 21/306 (2013.01); H01L 21/3065 (2013.01); H01L 21/30604 (2013.01); H01L 23/3735 (2013.01); H05K 1/0274 (2013.01); H05K 1/09 (2013.01); H05K 3/06 (2013.01); H05K 3/064 (2013.01); H05K 3/467 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0373 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/087 (2013.01);
Abstract

[Object] Provided are a laminate film and an electrode substrate film with excellent etching quality, in which a circuit pattern formed by etching processing is less visible under highly bright illumination, and a method of manufacturing the same. [Solving Means] A laminate film includes a transparent substrateformed of a resin film and a layered film provided on at least one surface of the transparent substrate. The layered film includes metal absorption layersandas a first layer and metal layers (), () as a second layer, counted from the transparent substrate side. The metal absorption layers are formed by a reactive sputtering method which uses a metal target made of Ni alone or an alloy containing two or more elements selected from Ni, Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, and Cu, and a reactive gas containing oxygen. The reactive gas contains hydrogen.


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